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New Generations of Highly Integrated High Temperature DC-DC Converters
Keywords: High Temperature Electronics, Point-of-Load Buck DC-DC Converters, Flyback DC-DC Converters
In high temperature applications, PCB footprint and weight are critical aspects. It is why electronic system designers are continuously looking for new IC solutions in order to optimize the size and cooling requirements of their power supplies. Few years ago, first generations of very high temperature DC-DC converters have been reported implementing both Buck [1] and Isolated Flyback [2] topologies. New, low power, compact, multiple outputs power supplies can now be implemented with FUJI Flyback DC-DC converter, eventually followed by VEGA or RIGEL linear voltage regulators [3], depending on accuracy and output ripple requirements. One step ahead in terms of integration and power efficiency will be made with YELLOWSTONE chip. YELLOWSTONE is a single chip, low-voltage, synchronous Buck DC-DC converter implementing a current mode PWM controller with built-in N & P-channel power MOSFETs. It aims to be used where there is a need for a Point-of-Load (PoL) switched mode power supply with a maximum output current of 500mA. It generates from a typical +3.3V or +5V voltage input a lower voltage output configurable between +0.9V and +3.3V by an external resistor network. It has been specified and designed for operation at temperatures from -55°C to +225°C. Synchronous rectification increases efficiency and reduces external components count. The circuit achieves power efficiencies in excess of 90% (Vout=3.3V). The chip implements a current mode PWM control which enables a fast response to line and load transient variations. A high switching frequency operation has been selected enabling a dramatic reduction of the number and size of passive external components. The current mode control makes possible to use a simple compensation loop. High switching frequency (1.5MHz typical with internal clock and up to 2MHz with external clock) enables to shrink the size of the LC filter. High integration level, tiny IC package (5mm*5.5mm) and small external passive components, lead to very small footprint for the complete PoL function, i.e. as small as 0.25inch² (10mm*15mm).
Pierre Delatte, CTO
Mont-Saint-Guibert, Brabant Wallon

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