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Strength and Reliability of High Temperature Transient Liquid Phase Sintered Joints
Keywords: Transient Liquid Phase Sintering, Lead Free Solder, Reliability
Low temperature transient liquid phase sintering (LT-TLPS) can be used to form high-temperature joints between metallic interfaces at low process temperatures [1,2]. In this paper, we will describe the processing and shear strength, along with the thermomechanical and shock fatigue resistance of sinter joints made by this process. Joints made from different ratios of Ni, Ag, and Cu high melting temperature metal constituents paired with Sn or In low melting temperature constituents have been evaluated. For the shear studies, test samples consisting of copper dice and copper substrates joined by sintering with a variety of sinter pastes have been assessed using a fixture designed for high temperature enabled shear tests at 25˚C, 125˚C, 250˚C, 400˚C, and 600˚C. Void free pastes capable of retaining >10 MPa shear strength at temperatures of 400˚C and 600˚C have been developed. The influence of the ratio of the amount of high melting-point constituent to the amount of low melting-point constituent on the maximum application temperature of the sinter paste will be discussed; as will the effect of sinter paste composition, particle size distribution and particle shape on voiding, process completion, and strength. The reliability of sinter paste joints in thermal cycling and drop-shock environments will also be discussed. Intermetallic joints surviving more than 500 drop shocks from 19
F. Patrick McCluskey, Associate Professor
University of Maryland, College Park
College Park, MD

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