Here is the abstract you requested from the hitec_2014 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Integrated Passive Devices with Embedded Capacitors and Resistors with outstanding stability and reliability for Harsh Environment applications.|
|Keywords: 3D Silicon Capacitors, Resistors, passives|
|The 3D Silicon technology of IPDiA is a disruptive technology for miniaturization adopted by the best players in the Industrial segment in various fields like automotive electronics and down hole drilling equipment for its high stability and high reliability demonstrated in high temperature environment, exceeding 250°C. It is also adopted by the Medical domain for its outstanding performance and reliability. The high density Silicon capacitors with multiple metal-insulator-metal (MIM) layer stacks in 3D structures are reaching today 250nF/mm2 in mass production and have been demonstrating even higher densities confirming the target of more than 4µF/mm² in the coming years. In this paper, the robustness of the 3D Silicon Capacitors and the Polysicon Resistors will be exposed, illustrated by reliability results obtained through innovative products .|