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Extreme Thermal Resistance of All-Polyimide Bondlines with TPI Adhesive
Keywords: thermoplastic polyimide adhesive (TPI), thermal interface material, CTE-mismatched lamination durability
All-polyimide bondlines utilizing thermoplastic polyimide adhesive (TPI) are very durable across a wide range of environmental conditions (thermal, physical, chemical), can withstand an extreme CTE-mismatch between laminated materials, and provide excellent adhesion in thicknesses down to only a few micron. A TPI thermal-interface bondline in an electronic packaging application can provide a thermal-impedance of less than 0.1oC-sqin/W, a shear strength of several thousand psi, and withstand continuous operation of over 250oC, as well as temporary exposure of well over 300oC. These features make TPI bondfilms ideal for heat-sealable bondlines in high temperature electronics. By only partial-curing, or B-staging, the TPI adhesive polymer during the bondfilm manufacturing process, the required lamination conditions – temperature, pressure and time – are significantly decreased, versus the lamination of conventional (fully cured) TPI systems, which require very specialized equipment and processing. In fact, the B-staged TPI bondfilm can produce robust laminations by merely placing binder-clipped assemblies in a toaster oven until the bond temperature is reached.
Jim Fraivillig, President
Fraivillig Technologies
Boston, MA
USA


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