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Development and Characterization of a Thin Wafer Shipping Solution
Keywords: Thin wafer shipping , 3DIC , HWS
Development and Characterization of a Thin Wafer Shipping Solution Isao Takeuchi, Kosuke Yasuda, Achilles USA, Inc., M. Nishijima, Tatsu Yanagawa, Achilles Japan, Corp. Vidhya Ramachandran, Anthony Newman, Urmi Ray (Qualcomm Technologies, Inc.) Market growth and the increased complexity of 3D-IC thin wafer (50µ to 200µ) supply chain have expanded the utilization of horizontal wafer shipping containers (HWS) for thin-wafer transportation. Standard drop/shock tests used to qualify shippers for thin wafers have been found to be inadequate to mimic actual shipping conditions for thin wafers. Often, shippers that have passed several standard drop/shock tests are unable to sufficiently protect thin wafers from shipping damage. This indicates a lack of correlation between true shipping conditions and these standard tests. In this work, extensive characterization of impact in a standard freight shipping process has been performed to identify the correct drop conditions to be applied for Achilles’ HWS. Subsequently, the reliability of this HWS system to safely transport thin wafers has been tested with drop and vibration test conditions exceeding those determined in the freight shipping process characterization. We show that Achilles’ HWS system not only protects thin wafers but also reduces the overall transportation cost by being more compact than other alternatives. In addition to HWS shock protection capability; we propose that incoming wafer quality is a key factor for safe shipping of thin wafers.
Isao Takeuchi,
ACHILLES USA, INC.
Everett, WA
USA


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