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Suppressing the hot spot temperature in 3-D ICs using all-carbon thermal management approach
Keywords: thermal management, 3D-IC, carbon nanomaterial
With the implementation of carbon nanomaterials, effective thermal management in three-dimensional integrated circuits (3-D ICs) is addressed in this work. Graphene (GR) heat spreaders are at first inserted into the 3-D ICs to effectively suppress the temperature at certain hot spot. Then, distributed thermal through-silicon vias (TTSV) are further introduced to fast conduct the heat to bottom substrate, which can be made of carbon nanotube (CNT) bundle.The contact thermal resistance between side heat sink and bonding wire is also considered. This work aims to provide design strategy of all-carbon thermal management for 3-D ICs.
Linjuan Huang,
OptoElectronics Integration and Packaging Lab., Univeristy of California, Irvine
irvine, CA
USA


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