Micross

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Managing Voids in Adhesives for Medical Devices
Keywords: Voids, Silicone Adhesives, Medical Devices
Void content within the adhesive layer dispensed over the connector module in neuromodulation devices is critical. Voids can affect the thermal transfer, bond strength, and stress decoupling of the adhesive, which can eventually lead to degraded device reliability. The effects of voids are investigated for a silicone based adhesive used in these medical devices. There are many challenges associated with the curing process that this adhesive undergoes which drive the need for unique and specific testing to determine optimal process settings. The parameters evaluated included curing time, temperature, airflow, thickness, and humidity. It was observed that surface treatment, dispensing sequences, and the interface between the bonding adhesive and the substrate affects void formation. Reduction in void content was linked to improvement in mechanical properties, including hardness, tensile strength and elongation. Data was also used to determine accuracy and repeatability on such devices. Achievement of void free medical adhesives will encourage today’s microelectronic packaging industry to meet the challenges of smaller and denser medical devices
Mary C. Ruales, Associate Professor
Universidad del Turabo
Caguas, PR
USA


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