Abstract Preview

Here is the abstract you requested from the imaps_2014 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.

POP Technology for the Automotive Industry
Keywords: POP, Automotive, 3D
POP for Automotive Applications Package-on-package (POP) technology has been in production for commercial applications for many years. The need for POP is typically driven by demands of increased processor and memory performance within smaller spaces, as evidenced by its significant usage in the mobile and tablet space. With the maturity and excellent historical performance of POP technology used with TI’s OMAP processor products, POP is now proven as a reliable packaging strategy for usage with the automotive industry, where the location of processors and required memory are once again needed in small areas. This paper will describe the work involved in the application of commercial POP technology, and enablement of POP technology for the automotive industry. The challenges and requirements regarding warpage performance, design considerations, board-level reliability performance and SMT characterizations will be explained.
S. Craig Beddingfield, Flip Chip Technology Manager
Texas Instruments
Dallas, TX

  • Amkor
  • ASE
  • Canon
  • EMD Performance Materials
  • GaN Systems
  • Honeywell
  • Indium
  • Isola Group
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • Palomar
  • Plexus
  • Qualcomm
  • Quik-Pak
  • Specialty Coating Systems