Abstract Preview

Here is the abstract you requested from the imaps_2014 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.

An Integrated FDC-centric Approach for Process Engineering in BEOL for Advanced Packaging – A Case Study in Die Singulation Process Optimization
Keywords: Fault Detection and Classification, Die Singulation, Advanced Packaging
Processing technologies for advanced packaging fabrications, especially for the back-end of the line (BEOL), must meet stringent challenges in yield in order to become industry-enabling. Die singulation processes, both laser grooving and blade dicing, are prime examples that can potentially become an inflection point in cost-effectiveness for product development. Ever increasingly sophisticated materials and aggressive device designs continue to impel the pass-fail limits of die edge defects like chipping and delamination. In addition to phenomenological understanding, progressive integration in process control can also accelerate process optimization. DISCO Corporation and Rudolph Technologies have combined their industry-leading knowledge and experience to create a Fault Detection and Classification-centric (FDC) process approach for die singulation. In this case, FDC software is employed to proactively examine and interact with the processing equipment. A server-based central command can dissect equipment information during processing, and perform distress actions like pausing or stopping the process at the moment of equipment failure or excursion prompting for operator or engineer action. This reduces process defect generations leading to product loss, and reduces the costs of labor needed for process monitoring at an equivalent level. Cycle times also improve as higher equipment uptime can be maintained. In-line idling and alarms are highlighted and quantified, whose resolution lead to potential improvements in throughput. In addition, powerful analysis tools allow engineers to compare and drill down tools’ behavior for die singulation process in order to improve the equipment fleet performance.
Richard Beaver,
Rudolph Technologies, Inc.
Richardson, TX

  • Amkor
  • ASE
  • Canon
  • Corning
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • Palomar
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Rochester Electronics
  • Specialty Coating Systems
  • Spectrum Semiconductor Materials
  • Technic