Here is the abstract you requested from the imaps_2014 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Custom Thickness Bare Die Availability of Any Product Through Device Extraction, Thinning, and UBM Pad Re-Conditioning|
|Keywords: Die Harvesting, Die Thinning, Pad Reconditioning with UBM|
|OEM bare die availability, when possible, presents business challenges with respect to lead-times, minimum order quantities, and required thicknesses for the target applications. Until recently, there has been no capability available to provide an economical, low or high volume manufacturable process for the production of bare die from packaged devices. Specifically, the die can be harvested from any package, the original bonds removed completely, the pads reconditioned with a UBM (Under Bump Metal) electroless process, and the die delivered in a condition which allows it to be used identically to an OEM bare die. The die can also be custom thinned down to 75 um (3 mils thick) if required by the application, while maintaining the same functionality and reliability compared to a die which has been diced from a wafer. The proposed process is extremely valuable for any organization requiring quick turn, low-volume quantities of bare die for prototyping or higher volumes for production manufacturing. The bare die can be custom thinned for any subsequent packaging assembly requirement. Thinning allows for die stacking and low-profile conventional packaging or CSP (chip-scale packaging) alternatives. End-customer assembly applications for harvested bare die range from prototyping, obsolescence solutions, high-temp ceramic assembly, and/or MCM's (multi-chip modules).|
|Erick M. Spory, President and CTO
Global Circuit Innovations, Inc.
Colorado Springs, Colorado