Here is the abstract you requested from the RF_2014 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Qualification of RF package for Automotive application|
|Keywords: RF component, Automotive, Qualification|
|The growth in automotive electronics is generating a new demand for semiconductor packages in engine controls, automotive safety, connectivity and infotainment. Lead frame packages such as SOIC, TSOPs, TQFPS, SOTs are some of the packages typically used in automotive applications. Additionally, flip chip packages, such as PBGA, FBGAs and CSPs are also finding application in automotive industry. Qualification of automotive packages requires suppliers to meet the US standard TS16949 for domestic customers and the European standard VDA6.3 for European customers. The paper reviews the PPAP (production parts approval process)data collection requirements, process controls , X-sectional analysis, CSAM testing and reliability testing qualification results for automotive package.|
|Mumtaz Bora, Staff, Packaging Engineer
San Diego, CA