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Materials and Transmission Line Measurements Comparing HTCC and Thick Film Alumina
Keywords: HTCC, Alumina, Packaging
HTCC and thick film based packages continue to be used extensively in commercial, industrial and military products. However, detailed and comparative measurements of their material properties are difficult to find. Moreover, transmission line measurements showing and comparing their insertion loss is even scarcer. Therefore, this work remedies this deficiency by showing detailed measurements of HTCC ceramic and alumina thick film with extracted materials data from 1-30GHz and transmission line insertion loss for both microstrip and stripline. The resulting data will be useful for designers and technology managers who must make critical decisions about which materials to select for their product development.
Rick Sturdivant, CTO
RLS Design, Inc.
Fullerton, CA

  • Amkor
  • ASE
  • Canon
  • Corning
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • Palomar
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Specialty Coating Systems
  • Technic