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Broadband Electrical Modeling of Transitions and Interconnects Useful for PCB and Co-fired Ceramic Packaging.
Keywords: packaging, transitions, interconnects
There is an increasing need for broadband packaging at microwave and millimeter-wave frequencies. Because of the size constraints and interface requirements between integrated circuits, antennas and passive components, these broadband packages must use electrical signal transitions between various transmission line types. Electrical models are required that accurately predict the interconnect performance and can be easily used in state of the art design tools. This work presents electrical models of transitions and interconnects between stripline and microstrip that are valid over wide bandwidths and that can be integrated into electronic design software.
Rick Sturdivant,
RLS Design, Inc.
Fullerton, CA

  • Amkor
  • ASE
  • Canon
  • Corning
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
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  • Promex
  • Qualcomm
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  • Raytheon
  • Specialty Coating Systems
  • Technic