Here is the abstract you requested from the RF_2014 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Broadband Electrical Modeling of Transitions and Interconnects Useful for PCB and Co-fired Ceramic Packaging.|
|Keywords: packaging, transitions, interconnects|
|There is an increasing need for broadband packaging at microwave and millimeter-wave frequencies. Because of the size constraints and interface requirements between integrated circuits, antennas and passive components, these broadband packages must use electrical signal transitions between various transmission line types. Electrical models are required that accurately predict the interconnect performance and can be easily used in state of the art design tools. This work presents electrical models of transitions and interconnects between stripline and microstrip that are valid over wide bandwidths and that can be integrated into electronic design software.|
RLS Design, Inc.