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Challenges and Opportunities for Ceramic Packaging
Keywords: Ceramic Packages, RF Packaging, Microwave Packaging
Consumers are asking electronics with more and more functionalities, at the same time, are also requesting lower cost, smaller size and better energy efficiency. The choice of the packaging has a substantial effect on the cost of the final products. Ceramic packaging is facing challenges from two fronts: 1. Better and robust dices (or with encapsulation) that require less protection, traditionally provided by ceramics. 2. Better plastic materials. Over last 10 years, there is a slow and steady trend of migration away from ceramic packages to plastic packages. This presentation reviews the latest development in ceramic packaging, discusses in detail the challenges faced by ceramic packaging manufacturers and highlights the future opportunities for ceramic packages.
Ken Kuang, President
Torrey Hills Technologies, LLC
San Diego, California

  • Amkor
  • ASE
  • Canon
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • Palomar
  • Plexus
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Specialty Coating Systems