Here is the abstract you requested from the RF_2014 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Challenges and Opportunities for Ceramic Packaging|
|Keywords: Ceramic Packages, RF Packaging, Microwave Packaging|
|Consumers are asking electronics with more and more functionalities, at the same time, are also requesting lower cost, smaller size and better energy efficiency. The choice of the packaging has a substantial effect on the cost of the final products. Ceramic packaging is facing challenges from two fronts: 1. Better and robust dices (or with encapsulation) that require less protection, traditionally provided by ceramics. 2. Better plastic materials. Over last 10 years, there is a slow and steady trend of migration away from ceramic packages to plastic packages. This presentation reviews the latest development in ceramic packaging, discusses in detail the challenges faced by ceramic packaging manufacturers and highlights the future opportunities for ceramic packages.|
|Ken Kuang, President
Torrey Hills Technologies, LLC
San Diego, California