Here is the abstract you requested from the RF_2014 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Surface Preparation for Wire Bonding|
|Keywords: Wire Bonding, Surface Preparation, Cleaning|
|Statistically significant studies have been performed by various organizations to determine the effectiveness of a selective CO2 particle-plasma surface treatment process for preparing bond pads for gold wire bonding operations. Robust surface treatment of bond pads is required to insure complete removal of a variety of possible surface contaminants for strong and reliable wire bonds following gold ribbon bonding operations. One such study compared and contrasted the performance of a single-step CO2 surface treatment method with that of a conventional multi-step solvent-plasma method. The two treatment methods were used to prepare the surface of a metalized ceramic wafer that simulated bond pad surfaces and treatment areas representative of the actual high-reliability electronic board. The test results of this evaluation demonstrated that the CO2 particle-plasma surface treatment process is statistically similar to or sometimes better than a solvent-plasma hybrid cleaning process. CO2 cleaning was determined to be better for some types of contaminants as well – and in particular more relevant mixed-contaminant challenge tests. The CO2 cleaning process demonstrates a lower defect-per-million (DPM) level and an improved CpK.|
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