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Surface Preparation for Wire Bonding
Keywords: Wire Bonding, Surface Preparation, Cleaning
Statistically significant studies have been performed by various organizations to determine the effectiveness of a selective CO2 particle-plasma surface treatment process for preparing bond pads for gold wire bonding operations. Robust surface treatment of bond pads is required to insure complete removal of a variety of possible surface contaminants for strong and reliable wire bonds following gold ribbon bonding operations. One such study compared and contrasted the performance of a single-step CO2 surface treatment method with that of a conventional multi-step solvent-plasma method. The two treatment methods were used to prepare the surface of a metalized ceramic wafer that simulated bond pad surfaces and treatment areas representative of the actual high-reliability electronic board. The test results of this evaluation demonstrated that the CO2 particle-plasma surface treatment process is statistically similar to or sometimes better than a solvent-plasma hybrid cleaning process. CO2 cleaning was determined to be better for some types of contaminants as well – and in particular more relevant mixed-contaminant challenge tests. The CO2 cleaning process demonstrates a lower defect-per-million (DPM) level and an improved CpK.
David Jackson,
CleanLogix LLC
Santa Clarita, CA

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