Here is the abstract you requested from the RF_2014 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Package and Board Effects in RF Multi-Function Assemblies|
|Keywords: RF Packaging, Multi-Function Assemblies, Simulation|
|As RF circuit density increases, it is becoming critical to integrate circuit level and electromagnetic analysis. Packages are now an integral part of the overall RF design, and may include such devices as antennas directly incorporated in the package. Improvements in design automation CAD software allow the user to easily integrate electromagnetic simulations directly from a simple 2.5D layout. The layout can be directly integrated with linear and non-linear circuit and system elements, all in a single user interface. This presentation is a continuation of one presented at IMAPs 2012. It builds on the first presentation, and shows a path to allow for higher levels of integration in package design. It will first briefly review the previous work and discuss the technical details behind the HFSS integration, such as ports and boundaries. These features have been automated in the Designer environment providing an easier way for the user to build, simulate and integrate these models. The next portion of the presentation will show a higher order flow with not only an RF chip-on-board, but an antenna molded directly into the package design. The design will consist of many MMIC amplifiers, each in single packages, mounted on a multi-layered substrate with stripline hybrids and various SMT components, including an integrated antenna and an external VCO. Overall performance will be simulated, and analyses performed to predict the linear and non-linear characteristics of the cascaded chain, including the effects of packaging, wirebonds, vias, and cross coupling on the antenna and components. If time permits, the link with ANSYS Mechanical will be presented, which simulates the thermal and mechanical effects of the chips, package, antenna and board. The link provides for a two-way interchange of information between electromagnetic and thermal simulations using a simple interface and a common model. Thermal and mechanical contributions can now be accounted for, such as temperature rise and thermal expansion effects on RF performance.|