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3D Research for Electronics Packaging
Keywords: Additive Manufacturing , Electronics Packaging, 3D Printing
3D research for electronics packaging Additive manufacturing commonly referred to as 3D printing allows physical objects to be built directly from 3D computer-aided-design (CAD) data without the need for tooling and with minimal human intervention. 3D printing has captured the public's imagination in recent years and is helping to inspire the next generation of budding engineers. However, the concept of additive manufacturing is not new and has actually been around for over 25 years since the invention of the Stereolithography process. So with all the media frenzy around 3D printing is this just hype or a range of processes with real potential to benefit various industries including electronics manufacture? This talk will cover the current limitations of 3D printing and the future potential in electronics manufacturing and packaging with a particular emphasis on relevant research currently being conducted at Loughborough University. Examples include locally controlling the permittivity of a host material through 3D printing to control the geometry and performance of an antenna, integrating various digital fabrication processes for template-less 3D electronic substrate manufacture and Additive Manufacturing processes for 3D packaging of electronic devices for harsh environments. Biography Dr. Robert Kay obtained an honours degree in Electrical & Electronic Engineering and a Ph.D in Microsystems Engineering from Heriot-Watt University, Edinburgh, UK. Robert is now a Senior Lecturer in Additive Manufacturing within the Wolfson School of Mechanical and Manufacturing engineering at Loughborough University. His research interests primarily focuses around using additive manufacturing processes for integrating microsystems technology into a wide range of applications for creating smarter more functional devices. During the course of Robert’s Doctorate studies he developed a novel microfabrication manufacturing process for the production of precision electroformed stencils used mainly for the deposition of interconnects for electronic packaging. He successfully commercialised this research by founding MicroStencil Limited in 2003. Through his supervision of the Company he scaled the product up for commercial production, build a diverse customer base and established a manufacturing partnership license agreement in Asia.
Dr. Robert Kay, Senior Lecturer
Additive Manufacturing Research Group (AMRG), Loughborough University
Leicester, UK
UK


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