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Development of Seven Layer Cu/Mo/Cu Thermal Management Material
Keywords: Heat Sinks, Thermal Management, Cu/Mo/Cu Laminate
With the increasing packaging density of integrated circuits and high power,the requirements for heat sinks are increasingly demanding. The traditional heat sinks like Invar, Kovar, Al, Cu, W, Mo, because of its single performance has been unable to meet the needs of the packaging industry development. The development of novel material with matched coefficient of thermal expansion, low density, high thermal conductivity and good strength and low cost is the development direction of heat sink materials. The three layer structure of CMC (Cu/Mo/Cu) heat sinks is applied more and more widely in the microwave, radio frequency field due to its good thermal conductivity and suitable thermal expansion coefficient. Structure of this kind of heat sinks are stacked, generally divided into three layers, the middle layer for low expansion material Mo, both sides is the high thermal conductivity of the material Cu. But for high power semiconductor devices, especially these devices with SiC and GaN chip need higher thermal conductivity for heat sink materials .Recently, the development of five or seven layers of CMC material are on researched. In this paper, seven-layer CMC materials were successfully prepared by used the diffusion welding and rolling method. The results show that the thermal conductivity of the seven-layer CMC is 250W/m.K, the coefficient of thermal expansion (300 C)) for 6x10-6/K, heremtic is 3x10-9Pa.m3/s.K, it fully meet the requirements of electronic packaging material.
Dr. Guosheng Jiang, Associate Professor
Central South University
Changsha, Hunan
CHINA


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