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Architecture Trends in Mobile Industry and Impact on Packaging and Integration
Keywords: Mobile, Architecture, Packaging and Integration
The last decade has seen an exponential growth in the mobile phone and computing industry. The emergence of smartphones and the ever growing demand of packing more and more features and functionality by the consumers has rapidly driven innovations in advanced packaging and integration. Smart integration at reasonable cost is a key to driving advanced functionality to mass market quickly. This talk will provide an overview of the latest trends in the mobile and wireless industries, with examples of architectural platforms, several disruptive technology platforms as well as evolutionary trends towards integration and miniaturization. Key focus of this presentation will be on emerging technologies, such as 2.5D TSV interposers and 3D IC integration. The applications of 3D IC integration include CMOS image sensor, MEMS, LED, memory + logic, logic + logic, memory + microproces¬sor. For 2.5D, active and passive interposers using Si and glass will be covered. Technology development challenges include tools, materials, infrastructure, reliability and many more. Several key challenges must be overcome before these integrations can be realized. In addition to lowering cost, increasingly complex tradeoffs, such as architectural partitioning, cost-performance-thermal, Chip-Package Interaction (CPI) must be managed. Electrical noise coupling, thermal interaction, and mechanical stress effects require multiphysics simulation and an infrastructure to support design for X across multiple domains. Tools, models, methodologies, materials, structural constructs, and experimental results are needed to ensure quality, yield and reliability. Current R&D and industry status will be presented, including technical, cost, business, standards and other factors important for rapid technology adoption.
Urmi Ray,
Qualcomm
San Diego, CA
USA


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