Here is the abstract you requested from the Thermal_2014 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Reworkable Power Module Design for Low Thermal Resistance|
|Keywords: power module, reworkable, packaging|
|The development of high reliability power semiconductor multi-chip modules (MCMs) can be challenging due to thermal management requirements and the potential need for rework. Packaging a high power part with the intention of rework can lead to solutions which reduce the efficacy of the thermal path. In this work, a package design is presented which combines a good thermal path with a simple rework process. The package features a die bonded to a heat spreader with a single, critical thermal interface to the backside of the module. The installation of the heat spreader can be achieved via fasteners, epoxy or solder depending on the requirements of the design. In this presentation, the assembly process will be discussed in detail along with the package concept. A detailed thermal analysis will be presented to articulate the thermal trade space of the design. Finally, high speed transient thermal test data and thermal imaging results will be presented and discussed relative to the thermal model of this packaging solution.|
|Nathan Young, Packaging Engineer
Sandia National Laboratories