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Fabrication and Measurement Challenges in Testing Single-Phase Water-based Microchannel and Galinstan-based Minichannel Cooling at High Heat Fluxes
Keywords: microchannel/minichannel, single-phase cooling, Galinstan
Microchannel heat sinks can cool extremely high heat fluxes through a combination of surface area enhancement and small length scales that enable low thermal resistance. Previously, Tuckerman and Pease [1] demonstrated a thermal resistance of 0.09°C/W when a heat flux of 790W/cm2 was imposed on a 1 cm × 1 cm footprint portion of a 400 µm-thick Si substrate utilizing single-phase water-based microchannel cooling with a 214 kPa system pressure drop. An experimental study [2] investigated both water-based microchannel and Galinstan-based minichannel test sections operating under the same size and pressure drop conditions used in [1]. Galinstan is an alloy of gallium, indium and tin that is liquid at room temperature. Testing of water-cooled microchannels demonstrated a thermal resistance of 0.071°C/W with a maximum heat flux of 1003W/cm2. The Galinstan-cooled minichannels demonstrated a thermal resistance of 0.077°C/W at a heat flux of 1214W/cm2; the maximum heat flux tested with this configuration was 1504W/cm2. This presentation will primarily discuss the fabrication methods and testing approaches used in this study and will provide a lessons-learned on the challenges of conducting micro/minichannel cooling studies and of working with liquid metals.
Rui Zhang,
Tufts University
Los Angeles, CA

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