Here is the abstract you requested from the Thermal_2014 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Fabrication and Measurement Challenges in Testing Single-Phase Water-based Microchannel and Galinstan-based Minichannel Cooling at High Heat Fluxes|
|Keywords: microchannel/minichannel, single-phase cooling, Galinstan|
|Microchannel heat sinks can cool extremely high heat fluxes through a combination of surface area enhancement and small length scales that enable low thermal resistance. Previously, Tuckerman and Pease  demonstrated a thermal resistance of 0.09°C/W when a heat flux of 790W/cm2 was imposed on a 1 cm × 1 cm footprint portion of a 400 µm-thick Si substrate utilizing single-phase water-based microchannel cooling with a 214 kPa system pressure drop. An experimental study  investigated both water-based microchannel and Galinstan-based minichannel test sections operating under the same size and pressure drop conditions used in . Galinstan is an alloy of gallium, indium and tin that is liquid at room temperature. Testing of water-cooled microchannels demonstrated a thermal resistance of 0.071°C/W with a maximum heat flux of 1003W/cm2. The Galinstan-cooled minichannels demonstrated a thermal resistance of 0.077°C/W at a heat flux of 1214W/cm2; the maximum heat flux tested with this configuration was 1504W/cm2. This presentation will primarily discuss the fabrication methods and testing approaches used in this study and will provide a lessons-learned on the challenges of conducting micro/minichannel cooling studies and of working with liquid metals.|
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