Here is the abstract you requested from the Thermal_2014 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Liquid Thermal Interface Materials for Mobile Electronics|
|Keywords: Mobile, Thermal Interface, Liquids|
|Thermal interface materials (TIM) have been used to transfer heat away from electronics devices for over two decades. Mobile devices like phones and tablets, however, represent a new challenge. These devices have increasing number of features in much smaller and thinner form factors. The development, and the high volume scale up, cycles are getting shorter - demanding a more flexibility in incorporating thermal materials. Use of soft conformable gaskets (Gap Pads) is more challenging due to form factor and proliferation of distinct part numbers for each thermal design. The use of one or two component liquids can address this challenge. Liquid materials can be used with automated dispensing equipment for fast design and scale up to high volume manufacturing. A limited number of liquid material solutions can also address the myriad designs with simple reprogramming of the dispense pattern. With better wetting and lower assembly stress, liquids offer better thermal transfer and ability to fit in thinner form factors. In this presentation we will present: (A) Key characteristics associated with liquid dispense materials, (B) Automation options and (C) several examples of liquid dispensed solutions for heat transfer in mobile electronics.|
|Sanjay Misra, Director of R&D
The Bergquist Company