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Ultra Thin-Light Titanium Based Thermal Ground Plane
Keywords: Titanium , Micro-Nano , TGP
The titanium based thermal ground plane (Ti-TGP) was developed in response to advanced portable semiconductor and aerospace applications that are searching for ultra-thin, flat, lightweight and reliable thermal solutions. Titanium outstanding mechanical properties and our developed a multi-scale fabrication technologies ( nano, micro and macro) on one titanium platform resulting in an ultra-thin TGP (600~900 μm) that still withstands the internal pressure while providing up to 45 W/C thermal conductance.
Payam Bozorgi ,
PiMEMS, Inc
Santa Barbara, CA
USA


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