Here is the abstract you requested from the Thermal_2014 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Ultra Thin-Light Titanium Based Thermal Ground Plane|
|Keywords: Titanium , Micro-Nano , TGP|
|The titanium based thermal ground plane (Ti-TGP) was developed in response to advanced portable semiconductor and aerospace applications that are searching for ultra-thin, flat, lightweight and reliable thermal solutions. Titanium outstanding mechanical properties and our developed a multi-scale fabrication technologies ( nano, micro and macro) on one titanium platform resulting in an ultra-thin TGP (600~900 μm) that still withstands the internal pressure while providing up to 45 W/°C thermal conductance.|
|Payam Bozorgi ,
Santa Barbara, CA