Here is the abstract you requested from the Thermal_2014 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|GE Technologies in Advanced thermal management of Packaging|
|Keywords: thermal interface material, synthetic jets, forced convection|
|The power density requirements continue to increase and the ability of thermal interface materials has not kept pace. General Electric spends over $5B every year on innovation and high reliability is critical to the markets GE serves. GE has developed two innovative thermal management technologies that provide significant improvements in thermal interface materials and forced convection cooling. GE has developed NanoSpring Bonding (NSB) material that allows for thin solder bondlines by using a compliant copper helix structure within the bondline to a manage large CTE mismatch of mating materials. NSB has a thermal impedance of <1mm2C/W which is significantly lower than current technology. The second innovation is Dual Cool Jets that provide active air cooling without any moving parts. The low physical form factor, low power consumption, and performance is demonstrated. The performance and reliability of these two innovations are presented.|
|David Shaddock, Electronics Packaging Engineer
General Electric Global Research