Here is the abstract you requested from the Thermal_2014 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|KEYNOTE: Managing Thermal & Mechanical Interactions with 2.5D and 3D IC’s|
|Keywords: Thermal, Mechanical, 3D IC|
|Current 2.5D and 3D chip integration technologies, targeting high performance and high density die-to-die interconnect, are reviewed. State of the Art is summarized, and the principal value propositions opportunities , and technology tradeoffs are highlighted. Principal implementation challenges are outlined, with focus on managing the thermal and mechanical interactions. It is concluded that whereas the thermal and mechanical challenges are not unique and specific to 2.5D and/or 3D stacks, use of these integration technologies does exacerbate the interactions. Possible methodologies for addressing and managing the thermal and mechanical challenges are outlined and discussed.|
|Riko Radojcic, Senior Director of Technology
San Diego, CA