Here is the abstract you requested from the Thermal_2014 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|KEYNOTE: Thermal and Mechanical Considerations and Challenges for Mobile and Handheld Products - System to Silicon|
|Keywords: Thermal, Mobile, Handheld|
|Consumers are drawn towards mobile devices (tablets, phablets, and phones) which provide thinner form factors, richer and bigger displays and better multimedia capabilities. The functionality crammed into mobile devices will only continue to grow as consumers turn to their mobile devices to do more of their complex and rich functionality tasks. Thermal management and control of these passively cooled devices is of prime importance given the chassis design constraints and thermodynamic space limitations. At the same time, end users expect high levels of performance from their hand-held and mobile devices, and the trend from one generation to the next is increased performance while reducing thermodynamic space (thinner devices). The intersection of these two design philosophies meets at the end-user expectations: is the user willing to trade ergonomics (hotter devices) for increased performance, or is the end user willing to sacrifice performance for better ergonomics & battery life? These questions bring unique challenges for the thermo-mechanical community. This talk discusses most of these major challenges for current and next-generation mobile devices from an industry perspective and also various approaches that need to be taken to balance performance with ergonomics in a quantifiable manner.|