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Thermal Design Optimization of SoC Packages and Handheld Systems
Keywords: Handheld Devices, Thermal Management, Thermal Mechanical Enabling
The ever increasing demands for smartphones and tablets with high resolution displays and improved functionality, pose engineering challenges of meeting aggressive form factor and device thickness requirements while maintaining thermal and power efficiencies. In handheld systems, an active cooling thermal solution such as a fan/heat sink does not exist and the system on chip (SoC) is passively cooled. The user experience as well as the performance of handheld devices is limited by ergonomic device skin temperature in steady-state operation while during high-power burst mode, the performance can be SoC junction temperature limited. Hence, it is critical to optimize the package and system thermal and mechanical design to enhance performance both for steady-state and transient operation of the device. In this presentation, thermal performance of handheld devices is discussed and the impact of SoC package design as well as system design on both system thermals and SoC performance is presented. Thermal modeling results and experimental data for various package- and system-level thermal solutions for skin and junction temperature mitigation are shown. Also, thermal mechanical interactions between the package-level thermal solutions and the SoC package is discussed to assure selection of the appropriate thermal solution to improve performance of the SOC and the system without compromising the component quality and reliability.
Tannaz Harirchian, Packaging Engineer
Intel Corporation
chandler, AZ

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