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Here is the abstract you requested from the Thermal_2014 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.

Development and Application of Clad Stainless Steel Thermal Management Components for Handheld, Mobile, and LED Systems
Keywords: Thermal Management, Heat Spreader, Composite Material
Recent developments for clad metals will be described, which enable thermal functionalization of structural components in high power devices. Thermal and structural designs are often considered separately, with one material selected to provide structural rigidity and a second material added to manage heat loads. A new composite material system will be presented to serve both purposes, utilizing high stiffness stainless steel skins clad over a low density, highly conductive Aluminum core. This configuration melds the best properties of each material, creating a fully formable composite structure with excellent mechanical and bulk thermal transport properties. Performance of the composite material will be discussed in terms of device design, and compared to common commercial solutions with support of thermal images and finite element modelling. It will be shown that thermal functionalization of structural components has the potential to streamline component manufacturing, save valuable internal space and improve the performance of high power devices.
Aaron Vodnick, Market Development Manager
Materion Corporation
Lincoln, RI
USA


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