Here is the abstract you requested from the Thermal_2014 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Reliability Testing of Nano Sintered Silver Die Attach Materials|
|Keywords: sintered silver die attach, reliability, harsh environments|
|Nano sintered silver materials have been shown to achieve very low thermal interface resistance when used as a die attach in microelectronics packaging. These materials can exhibit good long term reliability under high temperatures, making them good candidates for use in harsh environment electronics. This study investigated the thermal and reliability performance of two nano-sintered silver die attach materials along with a more conventional, silver-filled organic die attach. Test articles were fabricated with thermal test die that were attached to copper substrates. The thermal resistance of each test article was measured after component assembly and then periodically as the components subjected to thermal cycles (-55 to +125°C), with a total of 1500 thermal cycles being accumulated. Testing showed that the components with sintered silver die attach had lower thermal resistances than those with the organic die attach. The performance of all three of the die attach materials did degrade with cumulative thermal cycles, but to varying degrees. Test data were combined with finite element modeling of the test vehicle to estimate the thermal conductivity of the die attach materials.|
|Ross Wilcoxon, Principal Mechanical Engineer
Cedar Rapids, IA