Here is the abstract you requested from the Thermal_2014 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Development of Heat Pipe/Vapor Chamber Heat Spreader Thermal Measurement JEDEC Standard|
|Keywords: Heat Pipes, Heat Spreader, Measurement|
|Even though there is widespread use of Heat Pipes (HP) and Vapor Chamber Heat Spreaders (VCHS) in the electronics industry - ranging from the largest electronic systems to the smallest hand-held consumer devices - a comprehensive application-oriented thermal measurement standard in the JEDEC world does not yet exist. The need for such a standard is becoming paramount as HP and VCHS technology advances and more suppliers of these units enter the market. There has to be a way to compare technologies, materials and configurations so that end users can properly apply these units in their systems and devices. A suitable standard would allow users to determine performance/cost tradeoffs for technical and business optimization of their end products. This presentation will describe a proposed standard and, in keeping with the JEDEC format, will create and define parametric terms, provide a description of a suitable measurement setup, and outline a procedure for making the measurements. In order to insure repeatable and duplicatable measurements, a table of test condition and data reporting requirements will be included. The measurement setup description will be complete enough so the equipment can be reproduced by anyone reasonably experienced in making similar thermal measurement setups.|
|Bernie Siegal, George Meyer, President
Thermal Engineering Associates, Inc.
Santa Clara, CA