Here is the abstract you requested from the Thermal_2014 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Thermal Test Vehicle (TTV) Testing and Simulation of Package-on-Package (PoP) and Single-Die (SD) BGA Packages|
|Keywords: TTV, PoP, Thermal simulation|
|To meet challenging design cycle-times of SoC packages in mobile space, much emphasis is placed on various forms of simulations in order to predict package responses on several sensitive variables such as thermal performance. Due to various reasons such as proper design of thermal mgmt. system in hosting devices, it is imperative that the thermal models utilized in such simulations have a high level of accuracy associated with them. In order to achieve such confidence level, TTVs are utilized to validate thermal models. These programmable TTVs are available in earlier phases of product development cycle and they closely resemble the final product. Further, they enable us to perform a spectrum of critical thermal verification testing in order to validate thermal simulations. This presentation highlights the efforts validating 3D thermal models of PoP and SD packages by thermally exercising TTVs based on transient and steady-state power use-cases. It plots the dynamics of testing and how results are utilized to fine tune the thermal model.|
|Youmin Yu, Taravat Khadivi, Nader Nikfar, Principal/Mgr. Engineer
San Diego, California