Here is the abstract you requested from the wirebonding_2014 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|ENIG and ENEPIG as wire bondable surface finishes.|
|Keywords: wire bonding, ENIG, ENEPIG|
|These studies were undertaken by the IPC Plating Committee 4-14, to evaluate the bondability of electroless nickel immersion gold (ENIG) and electroless nickel, electroless palladium Immersion gold (ENEPIG). Samples of various ENIG thickness combinations were submitted to Hesse Mechatronics Inc where Aluminum and copper wire bonding was completed and pull strength was evaluated and documented. ENEPIG gold wire bonding was evaluated during the round robin studies that were conducted before completing the ENEPIG specification. This presentation includes a description of the surface finishes evaluated, the bonding methodology, the types and thickness of wires used and the pull strength achieved. Wire bonding was successful for both aluminum and copper wire for ENIG. The gold wire bondability of ENEPIG even at low gold thickness was verified. The wire bond strengths achieved meet industry standards.|
|George Milad, National Accounts Manager for Technology
Uyemura International Corp
Southington , CT