Micross

Abstract Preview

Here is the abstract you requested from the wirebonding_2014 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.

Active and Passive Vibration Control of Ultrasonic Bonding Transducers
Keywords: Ultrasonic Bonding, Transducers, Vibration Control
• Aim: Reduction of ultrasonic vibrations orthogonal to the main operation mode in wire bonding process. • Result: A novel prototype transducer with additional piezoelectric actuators in a specific configuration. • The system features high coupling to orthogonal vibration modes and acts neutral to main longitudinal vibrations. • The piezoelectric shunt damping technique with a passive LR-network as well as active vibration controls were studied. • Measurements were carried out with optimal tuned LR-network and optimal control actuator voltage. • A strong reduction in vibration amplitudes of the orthogonal vibrations without effecting the longitudinal vibrations was observed.
Dr. Hans Hesse ,
Hesse Mechatronics, Inc.
Mineola, NY
USA


CORPORATE PREMIER MEMBERS
  • Amkor
  • ASE
  • Canon
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • NGK NTK
  • Palomar
  • Plexus
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Specialty Coating Systems