Here is the abstract you requested from the wirebonding_2014 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Wedge tool design considerations|
|Keywords: wedge bonding, design considerations, process|
|The wedge bonding process is a common interconnection technology among other interconnection methods such as ball bonding, TAB, Flip-Chip & others. Although there have been significant breakthroughs in the development of innovative bonding solutions, wedge bonding remains the most popular method for applications that use Aluminum wire. The bonding process relies on the successful optimization of the bonding machine, the wire & the bonding tool. Each of these 3 factors needs to suit the application requirements & be inter-compatible with the other 2. The ability to design a complete process solution through the optimization of all affecting factors is the key to the success of the wire bonding process. There is a significant stage in bonding process optimization which necessitates the inspection of several tool designs when selecting the appropriate bonding tool. In analyzing the performance differences between tools, it's critical to identify the wedge parameters that affect bonding the most. The parameters that vary the most from one application to another are Front Radius, Back Radius, Bond Length, Wire Feed Angle & Hole Diameter. Each of the wedge parameters plays a specific role in over all bonding process performance. The compatibility of wedge parameters to the application requirements defines the process quality.|
|Uri Zaks, VP Engineering & Products Support
Micro Point Pro Ltd.
Yokneam Elite, Israel