Here is the abstract you requested from the wirebonding_2014 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Proliferation of bonding-wire types for IC interconnect|
|Keywords: Bonding Wire, IC Interconnect, Copper Wire|
|In the semiconductor industry, the use gold wire has been the most common material type and is widely used due to its excellent properties. However, with the increasing gold price trend, the industry has witnessed the rapid conversion of gold wire mainly in the IC segment by low cost wires such as bare copper wires since 2007 and coated copper wires since 2009 and bare copper alloy wire since 2012. More recently another new emerging wire type is silver alloy wire. By alloying silver with other precious metals, silver alloy wire has seen success in replacing gold wire in both LED and IC segment. To help reduce the confusion created by the proliferation of wire types, in this paper, we will discuss and compare the technical capabilities and cost of ownership of the various wire types. These alternatives now provide customers an additional degree of freedom to choose and select the most appropriate technology for wire materials other than gold.|
|Jack Belani, Vice President of Marketing
Heraeus Thick Film Division
San Jose, CA