Here is the abstract you requested from the wirebonding_2014 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Practical Ball Bump Techniques|
|Keywords: Ball Bump, Copper , Capillary|
|We will discuss Ball Bump techniques, problems and solutions using automatic gold wire bonders. The discussion will center on SEM analysis of ball bumps and how the requirement specification can create problems.|
|Mark S. Greenwell, Manager Sales and Customer Service
CoorsTek Inc. / GAISER