Micross

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Practical Ball Bump Techniques
Keywords: Ball Bump, Copper , Capillary
We will discuss Ball Bump techniques, problems and solutions using automatic gold wire bonders. The discussion will center on SEM analysis of ball bumps and how the requirement specification can create problems.
Mark S. Greenwell, Manager Sales and Customer Service
CoorsTek Inc. / GAISER
Ventura, CA
USA


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