Here is the abstract you requested from the wirebonding_2014 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Capillary Selection for Challenging Wire Bonding|
|Keywords: Capillary, Copper, Rough Finish|
|We will discuss the features in wire bonding capillaries that are important for improving wire bonding success at second bond in Gold (Au) and Copper (Cu) in challenging applications.|
|Mark S. Greenwell, Manager Sales and Customer Service
CoorsTek Inc. / GAISER