Here is the abstract you requested from the wirebonding_2014 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|High speed aluminum wire bonding for molded packages|
|Keywords: Wire Bonding, Aluminum, Molded Packages|
|This presentation will be a new look at aluminum wire bonding for molded plastic packages as an alternative to copper wire bonding. Aside from being less expensive than copper, aluminum wire bonding offers a number of other advantages such as room temperature bonding, elimination of any gas shielding required with copper wire bonding, bonding on bare copper leadframes eliminating the need for spot silver plating, bonding on active circuitry without the need for over pad metallization protection, and high temperature applicability due to the mono-metallic nature of the interconnect with the bond pads. Hardware and software modifications to a gold/copper ball bonder boosted wedge bonding throughput to a level comparable to current copper wire ball bonding (UPH of 12 wires/sec). The presentation will provide highlights of the development process covering the advantages listed earlier, including process definition for bonding on bare copper surfaces, capillary life improvement, clamping improvement, and reliability data on packages with green mold compounds.|
Texas Instruments Inc.
Santa Clara, CA