Micross

Abstract Preview

Here is the abstract you requested from the wirebonding_2014 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.

Transforming Wire bond Eco System
Keywords: Wire Bonding, Eco System, Copper
Cost effectiveness, flexibility and continuous transformation are the predominant factors keeping wire bonding as the key interconnect process in semiconductor packaging. Wire bonding eco system has been continuously transforming in recent times. Industry started to move from Au wire to Cu wire in the past 5 years; now migration to Ag wire is being actively pursued. The whole eco system from wafer fab, probe, wire, capillary, wire bonding equipment, molding to packaging materials are trying to adapt to this new evolution. Copper wire bonding is already in high volume production, now proliferation is entering into next phase of Cu wire bonding implementation on various challenging applications. Presentation shall focus on the knowledge frame work and process characterization methodologies for the next phase of Cu and Ag wire bonding proliferation.
Leroy Christie, Director Process and Package Technology
ASM Pacific Technology, Ltd.
Phoenix, AZ
USA


CORPORATE PREMIER MEMBERS
  • Amkor
  • ASE
  • Canon
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • NGK NTK
  • Palomar
  • Plexus
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Specialty Coating Systems