Abstract Preview

Here is the abstract you requested from the wirebonding_2014 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.

Semiconductor Market Update & Outlook: From Bonding Wire Perspective
Keywords: Bonding Wire, Semiconductor Market, Outlook
Discussion Outline: - 2013 Review of Semiconductor Industry and Growth; - Market Outlook and Growth for 2014; - Wire bond Roadmap Update; - Wire type trends update; - Wire diameter trends update; - Wire shipments update; and - Device/Package trends.
Bud Crockett, Jr., New Product Introduction, Business Development
Tanaka Denshi Group Saga
San Jose, CA

  • Amkor
  • ASE
  • Canon
  • Corning
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • Palomar
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Specialty Coating Systems
  • Technic