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SOLDER PASTE RESIDUE CORROSIVITY ASSESMENT: BONO TEST
Keywords: Reliability, Electrochemical migration, Corrosion
Lead free soldering with no clean solder pastes represent nowadays the most common process in electronic and microelectronic assembly. The risk for metal migration and leakage current could increase if the flux residues of solder materials react under the trend to operate at higher temperatures, higher voltages while exposed to harsh environmental conditions. A solder paste is usually considered as no clean if it passes all IPC J-STD-004 corrosion tests: copper mirror, copper panel corrosion test, Surface Insulation Resistance (SIR) and Elecrochemical Migration (ECM). Other SIR and ECM tests are described in Bellcore GR-78-CORE and JIS Z3197 standards. Although SIR and ECM tests are recognized by all standards authorities to evaluate the solder paste residue corrosivity after reflow process, a more selective method, the Bono test, has been developed and implemented by a group of French companies as a qualification criteria for industrial, automotive and telecom applications using mainly lead free materials. It has been proven that compared to common corrosion tests, the Bono test better differentiates the nature of solder paste residues.
EMMANUEL GUENE, APPLICATIONS MANAGER
INVENTEC PERFORMANCE CHEMICALS
VINCENNES, CEDEX
FRANCE


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