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Low Temperature Sintering Silver Paste Using MO Technology
Keywords: sintered silver, high thermal conductivity, low temperature
As the demand increases for high power electronics in automotives applications there is an ever growing need for better Thermal Interface Materials (TIM). This paper will discuss the results of newly developed nano-silver pastes with unique approach which uses MO (Metallo-organic) and resin reinforcing technology. These silver-resin pastes have strong adhesive properties to metalized dies and substrates along with high thermal conductivity and low electrical resistivity. The end result is a high thermal conductive adhesive with superior thermal and electrical performance while offering a low sintering temperature to protect electronics from damage. Nano-silver particles will easily agglomerates making it a difficult to process without some surface modifications. These particles need to be coated with a surfactant to prevent agglomeration and allow for good dispersion stability at room temperature. There are a variety of techniques to optimize the sintering performance and stability. The key to the MO technology is minimizing the coating material to provide a low temperature sintering process when heated in a low temperature curing oven. The nano-silver pastes show high electrical and thermal performance however degradation of die shear strength has been found by thermal cycling test due to the fragility of porous sintered structure. To improve the mechanical property, a resin reinforcing technology has been developed. By adding special resin to the pastes, the porous area is filled with the resin and the sintered structure is reinforced. There was no degradation in die shear strength after thermal cycling test to 1000 cycles. The combination of MO technology and resin reinforcing technology produce a durable die attach adhesive with outstanding thermal and electrical conductivity.
Ken Araujo, Area Manager
NAMIC Technologies, Inc.
Acushnet, MA
USA


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