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Breaking Barriers: New Silicone Adhesive Expands Your Design Toolbox
Keywords: adhesive, silicone, process
Automotive electronics is constantly increasing in demand for material performance. As the features and components become more intricate and complex and the packages shrink in size and volume, the design community begins to push the boundaries of their current toolbox. The automotive electronics design playground is limited by material sets that often need higher temperatures and longer time to achieve the structural adhesion that these critical applications often require. Additionally, there can often be material sensitivities or component incompatibilities that make achieving the required level of adhesion impossible without exasperating design modifications or treatments. There have been very few significant advances in the past several decades to support the great expansion in the material set and complexities of the components. Many substrates have remained incredibly challenging to bond with required strength and structural integrity. A unique new type of silicone chemistry utilizing a different cure mechanism enables adhesion to a broader class of substrates than is possible with the materials available today and has the potential to significantly lower assembly times and cure temperatures. This new platform of products will expand the toolbox and provide designers with the ability to select materials and components that were for many years prohibited, breaking the existing paradigm and truly inspiring creativity. Although significantly more advanced in many ways from traditional cures, this new silicone chemistry processes very similarly to standard high viscosity, thixotropic silicone adhesives. In addition, this new material continues to provide the benefits of silicones such as the expansive thermal stability range and elastomeric stress relief from impact, cycling, and vibration. This presentation will provide the basics on the new silicone chemistry, outline the compatible toolbox, discuss suitable electronics applications, and highlight performance advantages.
Kate Johnson, Application Engineering
Dow Corning Corporation
Schwenksville, PA
USA


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