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Automotive Grade Silicon Capacitors for 'Under the Hood' Applications
Keywords: silicon capacitors, automotive, atsc
The need for more and more electronics in the automotive field has led the manufacturers to reconsider the car design with more concern for space savings. A solution has been found by placing some of the electronics under the hood, avoiding the use of cumbersome harnesses. However, this has led to another constraint: produce long life components with performance preserved when exposed to harsh conditions. The most challenging parameters to be considered by 'under the hood' sensor manufacturers are reliability, operating temperature range and size. Most of capacitors used in these sensors assure a stable and reliable function up to 150C. For current and future requirements, this is not sufficient. Sensors used in ignition, oil pressure, ADS, motor management, etc. need better electronics integration and compliancy with operating temperatures from -55C to +200C. IPDiA silicon capacitors, already used extensively for many years in miniaturized equipment, show stability and reliability coupled with a low profile. IPDiA R&D center has developed a new range of silicon capacitors called ATSC dedicated to 'under the hood' applications that provide a reliable and stable solution up to 200C. ATS capacitors have been qualified according to the Automotive Electronics Council's AEC-Q100 requirements. Within the AEC-Q100, five different Part Operating Temperature Grades have been defined. The most stringent is Grade 0 with an operating temperature range from -40C to +150C. It must be pointed out that ATS capacitors have been subjected to tests from -55C to 200C which exceed the Grade 0 requirements of the AEC-Q100. The manufacture of IPDiA passive components is based on the PICS technology (Passive Integration Connecting Substrate). The benefits of this integrated passive silicon technology have already been demonstrated in terms of low leakage current, high stability, low aging and compliancy with operating high temperature. Due to their close integration to active components and innovative assembly technology, passive devices 'on silicon die' offer significant improvements for signal integrity and space savings compared with the commonly used SMD components. This paper reports on IPDiA high-density silicon automotive grade capacitors for 'under the hood' applications. It presents some results on capacitance stability, voltage derating, leakage current, lifetime and electromagnetic compatibility.
Laurent Lengignon,
Caen, Fr

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