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A New Automotive Packaging Platform Technology
Keywords: glass packaging, high-temperature passives, high-temperature interconnections
A new era in automotive electronics is beginning to emerge to serve a variety of needs that include comfort, safety, energy efficiency and electronic conveniences. One notable trend is the recent proliferation of communication systems, including wireless connectivity and RF- and mm-wave enabled functions. Another trend is for “under the hood” electronics requiring electronics that operates at temperatures of 175C and beyond. Georgia Tech PRC is developing glass packaging as a new packaging platform technology to address these and other technical challenges while reducing the cost, enabling miniaturization and heterogeneous integration. It views glass packaging as superior over organic packages and Si interposers for the following reasons: 1. Potentially lower cost than FR-4; 2. Si matching CTE, as well as GaAs-matching CTE; 3. Hermeticity and no-moisture absorption; 4. Thinner than FR-4; 5. High-temperature stability to over 500C; 6. Surface smoothness similar to Si but without chemical-mechanical polishing; 7. Ultra-low electrical loss; 8. Ultra-high resistivity; 9. Low dielectric constant; 10. High thermal conductivity, approaching Si where needed; 11. 3D Photonics in glass and coupling with electrical interconnections in low loss glass, unlike in Si; 12. Flexible (<30um thin) electronics by roll-to-roll; 13. Direct attach as a BGA to PCB board without the need for organic BGA; 14. Ability to form through holes, TSV-like interconnections similar in diameter and pitch to TSVs; 15. Exceptional dimensional stability for via-to-via alignment from layer to layer. Based on these attributes, Georgia Tech is exploring and demonstrating glass in a wide variety of electronic package architectures that include: 1) single chip BGA packaging for low cost, low warpage, high reliability and increased miniaturization of devices such as MEMS and sensors, 2) heterogeneous multi-chip integration in 2.5 architectures, and 3) entirely small systems packaging in 3D system package architecture with through-vias, similar in diameter and pitch to TSVs in Si to enable RDL and assembly of components on both sides to further miniaturize. The current applications include digital-single and multi-chip packaging, RF packaging, power packaging, millimeter-wave packaging, photonics packaging, analog packaging, camera packaging, MEMS and sensor packaging. Georgia Tech has identified 4 major areas to apply glass packaging for automotive electronics: 1. Wireless communications: these include mm-wave, MEMS, photonics, RF, meeting the reliability needs of 'under the hood' electronics; 2. High-temperature electronics: enabled by high-temperature dielectrics for RDL on glass, high-temperature passives for filtering and decoupling, high-temperature and high-throughput metastable SLID and Cu interconnections without solders, high-temperature underfills and EMC; 3. Power electronics: heterogeneous integration in intelligent power modules, with high-temperature Cu-based interconnections and assembly of high-power devices, and high-voltage high-temperature passives; 4. MEMS and sensor packaging: for minimum stress on the die with matched CTE, low cost based on large panel processing, hermetic packaging for reliability, low-stress Cu-based interconnections, integration of ASIC components to form 3D packages and direct attach-to-board.
Vanessa Smet,
Georgia Institute of Technology 3DPRC
Atlanta, GA

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