Here is the abstract you requested from the automotive_2015 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|HTCC Multi-layer Ceramic Packages for Automotive Sensor|
|Keywords: HTCC, Automotive Sensor, Ceramic Packages|
|Currently, 40 to 50 Semiconductor Sensors are being carried on luxury automobile and the number is expected to be more increased towards future. The increase of number requires further miniaturization of sensor device. Also, as the environment surrounding the sensor becomes more harsh conditions such as engine, exhaust gas environment and high voltage environment, the market tends to require highly reliable sensor module with environmental durability property. Kyocera HTCC multi-layer ceramic package supports those market requirements of miniaturization and high reliability with minimizing the routing area and enhanced design flexibility with its structures such as cavity and castellation and so on. Also, NiPdAu plating finish makes Au-wire, Al-wire, solder and Ag-paste available simultaneously and contributes to reduce the assembly area. Hermetic sealing with Seam-welding process is available sealing option for MEMS device applications such as for accelerometer and gyro sensor.|