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Image Sensor Package
Keywords: Image Sensor Package, ceramic lcc package, miniaturization
Currently, market requires miniaturization/low-profile/multi-function to package for image sensor application. Conventionally, the leaded pre-mold package has been used for the high-reliability segments, but applying ceramic LCC package additionally corresponds to the miniaturization/low-profile/multi-function requirements. Also, ceramic LCC package corresponds to the increase of I/O number. There are another advantages such as better heat-dissipation property for moving picture function, less denaturation against IR, availability of hermetic sealing. The improvement of board joint reliability and the easier assembly process with castellation structure is being confirmed. Also, as the technologies used in existing smart phone camera module for miniaturization and low-profile, the concept with FPC assembled on the bottom of package is available. As for further miniaturization and better heat dissipation, the concept with metal plate directly under image sensor (FPC on top of package) is also available. In addition, for further multi-function stream, the package concept to support multiple components such as DSP and Driver ICs, so called system-in-package image sensor module, is now available.
Adam Schubring,
Kyocera America
, MI
USA


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