Here is the abstract you requested from the automotive_2015 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Kyocera Chemical TITLE??|
|Keywords: 1, 2, 3|
|Recently, power devices such as IGBTs, LED power and automotive modules need more strict critical to quality and are reaching their performance limit with resin-based DA paste, so need a new solution to overcome technical hurdles. In addition, for environmental and health endangerment of lead reason, the semiconductor industry is making every effort to eliminate high-lead solder, where feasible. However, there is no single identified lead-free solution for all applications even now. Many of these devices have an essential safety purpose in automotive applications. The unique properties, such as the high melting point and thermal conductivity of these high-lead alloys, are necessary for the level of reliability required for these products. On the other hand, our company has already commercialized the high thermal conductive paste 'CT285' with 25W/m*K. However, it does not have enough electrical and thermal conductivity. Therefore, in order to the aim of further updates of the characteristic, we have developed pressure-less sintering paste 'XT2773R7', based on nano-Ag technology. The XT2773R7 demonstrates a thermal conductivity of more than 200 W/mK and excellent die shear adhesion to bare Cu as well as noble plating like gold and silver. Moreover, this paste shows excellent interface reliability in not only general automotive requirement(MSL1+-55C/150C/2000) but also in SiC application with high Tj(-40C/250C/1000), by adoption of original resin dispersion system.|