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Advances in Reliable Lead-free Assembly for Automotive Electronics
Keywords: solder, sintering, reliability
Although there are strong indications that high-Pb (>85%Pb) solders are still going to be applicable for use into the foreseeable future for automotive electronics, the twin forces of increased reliability and higher temperature stability of joining materials, are necessitating a move away from leaded solders for both SMT and die attach. This paper will review lead-free (Pb-free) technologies for a variety of applications, from die-attach to SMT assembly, including novel Pb-free solder paste technologies, sintering materials, flux-coated preforms and solder pastes with uniquely-adapted fluxes.
Andy C Mackie,
Indium Corporation
Clinton, NY
USA


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