Here is the abstract you requested from the automotive_2015 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Advances in Reliable Lead-free Assembly for Automotive Electronics|
|Keywords: solder, sintering, reliability|
|Although there are strong indications that high-Pb (>85%Pb) solders are still going to be applicable for use into the foreseeable future for automotive electronics, the twin forces of increased reliability and higher temperature stability of joining materials, are necessitating a move away from leaded solders for both SMT and die attach. This paper will review lead-free (Pb-free) technologies for a variety of applications, from die-attach to SMT assembly, including novel Pb-free solder paste technologies, sintering materials, flux-coated preforms and solder pastes with uniquely-adapted fluxes.|
|Andy C Mackie,