Micross

Abstract Preview

Here is the abstract you requested from the automotive_2015 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.

Enabling PoP Technology for Automotive ADAS Applications
Keywords: PoP, Automotive, Infotainment
Package-on-package (PoP) technology has revolutionized integrated circuit packaging due to its inherent advantages of memory / microprocessor integration and form factor miniaturization supporting historically commercial and portable electronic applications. Its maturity and robust high volume manufacturing (HVM) history with respect to TI OMAPTM processor products allows PoP technology to be developed and qualified as a reliable technology for the automotive industry. As such, TI introduces the industry’s first PoP geared for the automotive market, where demand for automotive ADAS has fueled advances in silicon and package technology requiring smaller form factors. This presentation will describe work to address the enviable challenge of zero defects and requirements for warpage control, surface mount (SMT) characterization, and board level reliability performance.
Jaimal M. Williamson, WW Semiconductor (SC) Packaging
Texas Instruments
, TX
USA


CORPORATE PREMIER MEMBERS
  • Amkor
  • ASE
  • Canon
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • NGK NTK
  • Palomar
  • Plexus
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Specialty Coating Systems